Silicon wafers, substrates and sample supports

Polished silicon is an excellent substrate for imaging, experiments, nanotechnology and micro-fabrication applications.  It is available in the form of wafers, diced wafer or as smaller chips (pieces). The silicon wafer and chips all have a <100> orientation. Cleaving of the wafers to the desired size with a <100> orientation wafers is straight forward and simple. The silicon wafers and chips are all P-type, doped with B to provide excellent conductivity for SEM, FIB and STM applications.
For biological applications silicon resembles glass, which makes it a suitable support for growing and/or mounting cells. For imaging applications, it is an ideal sample substrate for small particles due to the low background signal of the highly polished surface.
Two grades of silicon substrates are offered:

Micro-Tec <P/100> standard silicon wafers and diced wafer for SEM substrates
The Micro-Tec <P/100>  silicon wafer substrates can be used for sample substrates, micro-fabrication, substrate for thin film research or biological substrates. Useful flat substrate for SEM imaging of particles due to the low background. For biological applications, Si has similar properties as glass and can be used to mount or grow cells. Can be easily cleaved or used as a whole wafer. The Micro-Tec Si wafers are packed in a wafer carrier tray for protection. The diced wafer supplied on wafer adhesive disc and packed between two plastic sheets for protection. The Si chips can be easily lift off the adhesive sheet.
The Micro-Tec standard silicon wafer substrates are available as:

Nano-Tec ultra-flat <P/100> silicon wafers and ultra-flat silicon chips
The Nano-Tec, ultra-flat P<100> silicon wafers have higher specifications than the Micro-Tec silicon wafers. They are preferred for demanding applications in micro-fabrication, as substrates for thin film research or biological substrates. Excellent ultra-flat surface for high resolution SEM imaging of particles due to the low background signal. For biological applications, Si has similar properties as glass and can be used to mount or grow cells. The larger wafers with the <100> orientation can be easily cleaved to the desired size. The ultra-flat Nano-Tec Si wafers are clean-room packed in a wafer carrier tray for protection. The ultra-flat Si chips are precision diced with a dicing saw, cleaned and clean-room packed in a gel-box. They can be easily lift off the gel substrate with flat tipped tweezers.
The Nano-Tec ultra-flat silicon wafers are available as:

Micro-Tec P{100} silicon wafer Ø2inch/51mm, 275µm thickness
Product # Unit
10-008120 each
Micro-Tec P{100} silicon wafer, Ø4 inch/100mm, 525µm thickness
Product # Unit
10-008140 each
Micro-Tec P{100} silicon wafer, Ø6inch/150mm, 675µm thickness
Product # Unit
10-008160 each
Micro-Tec diced P{100} silicon wafer Ø 4inch / 100mm, diced in 5x5mm chips, 525µm thickness ~270 chips
Product # Unit
10-008145 each
Micro-Tec diced P{100} Ø4inch/100mm silicon wafer, diced in 10x10mm chips, 525µm thickness ~ 55 Chips
Product # Unit
10-008149 each
Nano-Tec ultra-flat P{100} silicon wafer, Ø4inch/100mm, 525µm thickness
Product # Unit
10-008141 each
Nano-Tec ultra-flat P{100} silicon wafer, Ø6inch/150mm, 675µm thickness
Product # Unit
10-008161 each
Nano-Tec ultra-flat P{100}silicon chips, 5x5mm, 25 in gel pack, 675µm thickness
Product # Unit
10-008150 each
Nano-Tec ultra-flat P{100} silicon with 200nm thermal SiO2 chips, 5x5mm, 25 each in gel pack, 675µm thickness
Product # Unit
10-008155 each