{"id":10743,"date":"2020-01-06T14:21:54","date_gmt":"2020-01-06T13:21:54","guid":{"rendered":"https:\/\/m-s.it\/prodotti\/lexes-ex-300\/"},"modified":"2020-03-20T13:59:55","modified_gmt":"2020-03-20T12:59:55","slug":"lexes-ex-300","status":"publish","type":"prodotti","link":"https:\/\/m-s.it\/en\/prodotti\/lexes-ex-300\/","title":{"rendered":"LEXES &#8211; EX 300"},"content":{"rendered":"\n<h5 class=\"wp-block-heading\">Front-end semiconductor compositional metrology solution for 22nm node and beyond.<\/h5>\n\n\n\n<p class=\"wp-block-paragraph\">CAMECA&#8217;s EX-300 is a unique&nbsp;LEXES&nbsp;based metrology tool supporting major semiconductor developments since the 90nm node era and following up the integration of the most diverse materials. It accelerates the time-to-market of your logic and memory devices and increases the integrated yield of your high volume production.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The EX-300 benefits from over a decade of experience with LEXES technology in the semiconductor industry: dozens of LEXFAB-300 Shallow Probes have been installed at the top-ten semiconductor fabrication facilities worldwide. The EX-300 is targeted for new challenging applications such as SiGe and HKMG, and it is designed to accelerate the time to market of advanced logic &amp; memory devices while achieving high production yield.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>The tool of choice for front-end process issues at 32nm node and beyond<\/strong><br>Based on the non-contact, non-destructive LEXES technique &#8211; a unique solution for direct measurement of the chemical composition at the surface and near surface &#8211; the EX-300 offers a panel of complementary capabilities enlarging the domains of classical metrology to current challenging processes:<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Ultra shallow implants: Monitoring of low energy, high concentration implants<\/li><li>Strained silicon process control: Chemical composition and thickness in epitaxial layers such as B:SiGe and P:SiC, with no limitation in the layer composition<\/li><li>HKMG metrology: Both the oxides and the metal are controled by one single EX-300 platform<\/li><\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">CAMECA&#8217;s EX-300 delivers enhanced long-term stability with excellent vacuum limit. The below graph shows reproducibility over several months for an average As dose of 1.97e15 at\/cm2 with a global RSD (1\u03c3) of 0.622%.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Advanced and robust pattern analysis<\/strong><br>The EX-300 has been specifically designed to perform metrology of challenging patterned wafers down to 30&#215;30\u00b5m pads.<br>Higher brightness is achieved with the new LaB6 gun, thus ensuring denser small probe. Improved light source and optics and a new digital camera with zooming capabilities enable smooth visual navigation while the new electrostatic chuck secures wafer clamping.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Optimized design and easy tool control for high uptime<\/strong><br>The EX-300 delivers 5 to 20% throughput improvements compared to the previous Shallow Probe LEXFAB-300 model (depending on application). Improved ergonomics allow rapid maintenance and thus optimized MTTR. The fully integrated LEXES-Pilot software provides a user-friendly interface as well as reliable factory automation.\n\n<\/p>\n","protected":false},"featured_media":8286,"parent":0,"template":"","categoria_prodotto":[314],"class_list":["post-10743","prodotti","type-prodotti","status-publish","has-post-thumbnail","hentry","categoria_prodotto-cameca-en"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.6 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Cameca LEXES - EX 300 - Media System Lab<\/title>\n<meta name=\"description\" content=\"Non-contact, non-destructive LEXES EX-300, front-end semiconductor compositional metrology solution for 22nm node and beyond.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/m-s.it\/en\/prodotti\/lexes-ex-300\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Cameca LEXES - EX 300 - Media System Lab\" \/>\n<meta property=\"og:description\" content=\"Non-contact, non-destructive LEXES EX-300, front-end semiconductor compositional metrology solution for 22nm node and beyond.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/m-s.it\/en\/prodotti\/lexes-ex-300\/\" \/>\n<meta property=\"og:site_name\" content=\"Media System Lab\" \/>\n<meta property=\"article:modified_time\" content=\"2020-03-20T12:59:55+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/m-s.it\/wp-content\/uploads\/2020\/01\/ex-300.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"315\" \/>\n\t<meta property=\"og:image:height\" content=\"220\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:site\" content=\"@MEDIASystemLab\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/m-s.it\\\/en\\\/prodotti\\\/lexes-ex-300\\\/\",\"url\":\"https:\\\/\\\/m-s.it\\\/en\\\/prodotti\\\/lexes-ex-300\\\/\",\"name\":\"Cameca LEXES - EX 300 - Media System Lab\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/m-s.it\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/m-s.it\\\/en\\\/prodotti\\\/lexes-ex-300\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/m-s.it\\\/en\\\/prodotti\\\/lexes-ex-300\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/m-s.it\\\/wp-content\\\/uploads\\\/2020\\\/01\\\/ex-300.jpg\",\"datePublished\":\"2020-01-06T13:21:54+00:00\",\"dateModified\":\"2020-03-20T12:59:55+00:00\",\"description\":\"Non-contact, non-destructive LEXES EX-300, front-end semiconductor compositional metrology solution for 22nm node and beyond.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/m-s.it\\\/en\\\/prodotti\\\/lexes-ex-300\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/m-s.it\\\/en\\\/prodotti\\\/lexes-ex-300\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/m-s.it\\\/en\\\/prodotti\\\/lexes-ex-300\\\/#primaryimage\",\"url\":\"https:\\\/\\\/m-s.it\\\/wp-content\\\/uploads\\\/2020\\\/01\\\/ex-300.jpg\",\"contentUrl\":\"https:\\\/\\\/m-s.it\\\/wp-content\\\/uploads\\\/2020\\\/01\\\/ex-300.jpg\",\"width\":315,\"height\":220,\"caption\":\"Soluzione metrologica compositiva per semiconduttori front-end per nodo 22nm e oltre\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/m-s.it\\\/en\\\/prodotti\\\/lexes-ex-300\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/m-s.it\\\/en\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Prodotti\",\"item\":\"https:\\\/\\\/m-s.it\\\/prodotti\\\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"LEXES &#8211; EX 300\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/m-s.it\\\/#website\",\"url\":\"https:\\\/\\\/m-s.it\\\/\",\"name\":\"Media System Lab\",\"description\":\"Il posto dei microscopisti. 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